A NOVEL FLIP-CHIP INTERCONNECTION TECHNIQUE USING SOLDER BUMPS FOR HIGH-SPEED PHOTORECEIVERS

被引：22

作者：

KATSURA, K

HAYASHI, T

OHIRA, F

HATA, S

IWASHITA, K

机构：

[1] NIPPON TELEGRAPH & TEL PUBL CORP, OPTOELECTR LABS, ATSUGI, KANAGAWA 24301, JAPAN

[2] NIPPON TELEGRAPH & TEL PUBL CORP, YOKOSUKA ELECT COMMUN LABS, TRANSMISSION SYST LABS, YOKOSUKA, KANAGAWA 23803, JAPAN

来源：

JOURNAL OF LIGHTWAVE TECHNOLOGY | 1990年 / 8卷 / 09期

关键词：

D O I：

10.1109/50.59160

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A flip-chip interconnection technique using small solder bumps instead of conventional wire bonding for high-speed broad-band photoreceivers is described. The technique achieves interconnection with low parasitic elements, no damage to devices, and easy assembly. A photoreceiver composed of a broad-band positive-intrinsic-negative (p-i-n) photodiode and a high-speed GaAs metal-semiconductor field-effect transistor (MESFET) preamplifier connected using solder bumps that are about 26 µm in diameter, with a frequency response of over 22 GHz at 1.55 µm, has been demonstrated. This confirms the effectiveness of the solder bump interconnection technique for future high-speed broad-band optical modules. © 1990 IEEE

引用

页码：1323 / 1327

页数：5