MULTILAYER CERAMIC PACKAGING ALTERNATIVES

This paper reviews the current state-of-the-art in multilayer substrates for integrated circuit (IC) packaging. The characteristics, advantages, and disadvantages of the following materials systems are presented: α-Al2O3, BeO, AlN, SiC, Si3N4, BN, mullite, cordierite, glass-ceramics, low-K composites, and polymer systems such as polyimide. These are discussed in both single dielectric configurations as well as more complex systems such as the thin film multi-chip module (TFMCM), Si-on-Si wafer-scale integration (SOSWSI), and packaging schemes that incorporate passive components such as capacitors in the substrate. he following conclusions are drawn: 1) the package is less and less just a protective environment and more and more a key functional part of the entire electronic system; 2) the systems manufacturer will play an increasingly important role as the creator of the package; 3) the multichip module (MCM) will slowly be replaced by such schemes as SOSWSI and especially TFMCM; 4) while Al2O3 will continue to dominate the materials field, a number of other materials will be increasingly used, especially AlN and SiC, where thermal dissipation is key, and Cu/polymer systems, where low dielectric constants are required. © 1990 IEEE