THE INFLUENCE OF STEPS ON THE DEPOSITION OF CU ONTO AU(111)

被引:130
作者
HOLZLE, MH [1 ]
ZWING, V [1 ]
KOLB, DM [1 ]
机构
[1] UNIV ULM,DEPT ELECTROCHEM,D-89069 ULM,GERMANY
关键词
METAL DEPOSITION; NUCLEATION; STEPPED SURFACES; COPPER; UNDERPOTENTIAL DEPOSITION;
D O I
10.1016/0013-4686(95)00055-J
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
The deposition of Cu onto stepped Au(111) surfaces from sulfuric acid solutions has been studied in the underpotential and overpotential range in order to elucidate the role of surface defects in deposition kinetics. Au(111) surfaces of different step densities have been prepared by cutting four single crystals between 0.7 and 4.5 degrees off their [111] axis. Au(111) surfaces roughened by oxidation-reduction cycles were also included in the study for comparison. Current transients revealed a marked influence of the step density on the nucleation rates, both for structural transitions within the Cu adlayer at underpotentials and for bulk deposition. Variation of the step density allowed for an assignment of voltammetric features to the underpotential deposition of Cu at steps or terraces. For bulk Cu deposition the critical free energy of nucleation and the size of the critical Cu nucleus were determined.
引用
收藏
页码:1237 / 1247
页数:11
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