EFFECT OF SURFACE CONTAMINATION ON THERMOCOMPRESSION BONDABILITY OF GOLD

被引：47

作者：

JELLISON, JL ^{[1
]}

机构：

[1] SANDIA LABS,MET DEPT,ALBUQUERQUE,NM 87115

来源：

IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING | 1975年 / 11卷 / 03期

关键词：

D O I：

10.1109/TPHP.1975.1135065

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：206 / 211

页数：6

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