CONSTRUCTION AND CHARACTERIZATION OF A 117-CM(2) SILICON PIXEL DETECTOR

被引：12

作者：

HEIJNE, EHM

ANTINORI, F

BARBERIS, D

BEKER, H

BEUSCH, W

BURGER, P

CAMPBELL, M

CANTATORE, E

CATANESI, MG

CHESI, E

DARBO, G

DAURIA, S

DAVIA, C

DIBARI, D

DILIBERTO, S

ELIA, D

GYS, T

HELSTRUP, H

HEUSER, JM

JACHOLKOWSKI, A

JARRON, P

KLEMPT, W

KRALIK, I

KRUMMENACHER, F

LASALLE, JC

LEITNER, R

LEMEILLEUR, F

LENTI, V

LOKAJICEK, M

LOPEZ, L

LUPTAK, M

MAGGI, G

MARTINENGO, P

MEDDI, F

MENETREY, A

MIDDELKAMP, P

MORANDO, M

MUNNS, A

MUSICO, P

PELLEGRINI, F

POSPISIL, S

QUERCIGH, E

RIDKY, J

ROSSI, L

SAFARIK, K

SALADINO, S

SEGATO, G

SIMONE, S

SNOEYS, W

STEFANINI, G

机构：

[1] UNIV BARI,BARI,ITALY

[2] UNIV GLASGOW,GLASGOW G61 1BD,LANARK,SCOTLAND

[3] UNIV GRP PRAHA,PRAGUE,CZECH REPUBLIC

[4] INST PHYS EXPTL,KOSICE,SLOVAKIA

[5] GHS WUPPERTAL,WUPPERTAL,GERMANY

[6] CANBERRA SEMICOND NV,CANBERRA,ACT,AUSTRALIA

[7] GEC MARCONI LTD,CASWELL,NORTHANTS,ENGLAND

来源：

IEEE TRANSACTIONS ON NUCLEAR SCIENCE | 1995年 / 42卷 / 04期

关键词：

D O I：

10.1109/23.467810

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A silicon pixel detector, developed in RD19, and consisting of 4 planes, similar to 30 cm(2) each, is operating for the first time in the lead ion experiment WA97 at CERN. The 288 CMOS readout chips are bump-bonded to 48 Si detector matrices, assembled in 8 identical arrays. The total number of pixel cells is nearly 300 000 and each cell, 75 mu m x 500 mu m, contains a complete signal processing chain. Overall dead area is less than 3%.

引用

页码：413 / 418

页数：6

共 4 条

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