INFLUENCE OF THE ADDITIVES (TU) AND (PEG) ON THE UNDERPOTENTIAL DEPOSITION OF COPPER ON PLATINUM-ELECTRODES - A COULOMETRIC, MICROGRAVIMETRIC AND TOPOGRAPHIC STUDY

被引：28

作者：

WUNSCHE, M ^{[1
]}

NICHOLS, RJ ^{[1
]}

SCHUMACHER, R ^{[1
]}

BECKMANN, W ^{[1
]}

MEYER, H ^{[1
]}

机构：

[1] SCHERING AG,FORSCH ABT GALVANOTECH,MULLERSTR 170-178,W-1000 BERLIN 65,GERMANY

来源：

ELECTROCHIMICA ACTA | 1993年 / 38卷 / 05期

关键词：

UNDERPOTENTIAL DEPOSITION; ELECTROCRYSTALLIZATION; QUARTZ MICROBALANCE; STM; ORGANIC ADDITIVES;

D O I：

10.1016/0013-4686(93)80233-P

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

We have studied the influence of additives such as thiourea (TU) and polyethyleneglycol (PEG) on the underpotential deposition of Cu on Pt using coulometry, in situ microgravimetry and STM. STM images taken with and without additives are consistent with evenly dispersed copper adlayers, while in the bulk region microcrystallites are formed. The sputtered Pt samples may obtain a preferential orientation after extended potential cycling in electrolyte solutions due to electrochemical faceting. The electrosorption valency tau of Cu on Pt for these samples is 1.2 +/- 0.3. Tau remains unaffected if TU and PEG are present in the electrolyte.

引用

页码：647 / 652

页数：6

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