BENZOCYCLOBUTENE (BCB) DIELECTRICS FOR THE FABRICATION OF HIGH-DENSITY, THIN-FILM MULTICHIP MODULES

被引：106

作者：

BURDEAUX, D ^{[1
]}

TOWNSEND, P ^{[1
]}

CARR, J ^{[1
]}

GARROU, P ^{[1
]}

机构：

[1] DOW CHEM CO USA,CENT RES,CHARLOTTE,NC 28210

来源：

JOURNAL OF ELECTRONIC MATERIALS | 1990年 / 19卷 / 12期

关键词：

BENZOCYCLOBUTENE; BCB; MULTICHIP MODULE; DIELECTRIC;

D O I：

10.1007/BF02662825

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

A new class of organic dielectrics, benzocyclobutenes, 1, are described and their application to the fabrication of thin film multichip modules is detailed. Key properties for 3, a siloxy containing BCB derivative include low dielectric constant (2.7), low loss (0.008 at 1 MHz), low water absorption (0.25% after 24 h water boil) and high degree of planarization (> 90% from one layer coverage). All other properties meet the requirements necessary for fabrication of thin film MCM structures.

引用

页码：1357 / 1364

页数：8

共 36 条

[31] TESSIER TG, 1989, 39TH P EL COMP C, P127
[32] ELASTIC RELATIONSHIPS IN LAYERED COMPOSITE MEDIA WITH APPROXIMATION FOR THE CASE OF THIN-FILMS ON A THICK SUBSTRATE
TOWNSEND, PH
BARNETT, DM
BRUNNER, TA
[J]. JOURNAL OF APPLIED PHYSICS, 1987, 62 (11) : 4438 - 4444
[33] TOWNSEND PH, 1989, 3RD P INT SAMPE EL C, P67
[34] Tummala R. R, 1989, MICROELECTRONICS PAC
[35] Watari T., 1985, 35th Electronic Components Conference (Cat. No. 85CH2184-0), P192
[36] Yamada T., 1985, Fifth Annual International Electronics Packaging Conference. Proceedings of the Technical Conference, P551

← 1 2 3 4 →