A STUDY OF THE INITIAL GROWTH-KINETICS OF THE COPPER-ALUMINUM THIN-FILM INTERFACE REACTION BY INSITU X-RAY-DIFFRACTION AND RUTHERFORD BACKSCATTERING ANALYSIS

被引:39
作者
HAMM, RA
VANDENBERG, JM
机构
关键词
D O I
10.1063/1.333960
中图分类号
O59 [应用物理学];
学科分类号
摘要
引用
收藏
页码:293 / 299
页数:7
相关论文
共 18 条
[1]  
ASKILL J, 1970, TRACER DIFFUSION DAT, P21
[2]  
BRAGG WH, 1905, PHILOS MAG, V10, pS318
[3]  
CAMPISANO SU, 1978, THIN SOLID FILMS, V52, P97, DOI 10.1016/0040-6090(78)90260-2
[4]  
CAMPISANO SU, UNPUB THIN SOLID FIL
[5]  
CHU WK, 1978, BACKSCATTERING SPECT, P362
[6]  
FEDOR R, 1970, J APPL CRYSTALLOGR, V3, P372
[7]   INTERDIFFUSION IN AL-CU SYSTEM [J].
FUNAMIZU, Y ;
WATANABE, K .
TRANSACTIONS OF THE JAPAN INSTITUTE OF METALS, 1971, 12 (03) :147-&
[8]   INVESTIGATION OF DIFFUSION IN CU-AL THIN-FILM SYSTEM [J].
GERSHINSKII, AE ;
FOMIN, BI ;
CHEREPOV, EI ;
EDELMAN, FL .
THIN SOLID FILMS, 1977, 42 (03) :269-275
[9]  
HAMM RW, UNPUB
[10]   A FITTING METHOD FOR X-RAY-DIFFRACTION PROFILES [J].
HECQ, M .
JOURNAL OF APPLIED CRYSTALLOGRAPHY, 1981, 14 (FEB) :60-61