SEMICONDUCTOR WAFER REPRESENTATION FOR TCAD

被引:4
作者
GILES, MD
BONING, DS
CHIN, GR
DIETRICH, WC
KARASICK, MS
LAW, ME
MOZUMDER, PK
NACKMAN, LR
RAJAN, VT
WALKER, DMH
WANG, RH
WONG, AS
机构
[1] TEXAS INSTRUMENTS INC,CTR SEMICOND PROC & DESIGN,DALLAS,TX 75266
[2] STANFORD UNIV,STANFORD,CA 94305
[3] IBM CORP,THOMAS J WATSON RES CTR,MFG RES DEPT,MODELLING SYST PROJECT,YORKTOWN HTS,NY 10598
[4] UNIV FLORIDA,SRC RES ADV DEVICE & CIRCUIT MODELING,GAINESVILLE,FL
[5] CARNEGIE MELLON UNIV,DEPT ELECT & COMP ENGN,SRC,EXCELLENCE COMP AIDED DESIGN RES CTR,PITTSBURGH,PA 15213
[6] UNIV CALIF BERKELEY,ELECTR RES LAB,BERKELEY,CA 94720
[7] INTEL CORP,TECHNOL CAD DEPT,SANTA CLARA,CA 95052
关键词
D O I
10.1109/43.273747
中图分类号
TP3 [计算技术、计算机技术];
学科分类号
0812 ;
摘要
This paper describes the Semiconductor Wafer Representation (SWR) for representing and manipulating wafer state during process and device simulation. The goal of the SWR is to provide an object-oriented interface to a collection of functions designed for developing and integrating Technology CAD (TCAD) applications. By providing functions which can be common across many applications, we aim to greatly reduce tool development and integration time. Corporate, vendor, and university TCAD developers have worked together under the auspices of the CAD Framework Initiative to create an architecture and C++ programming interface for an SWR 1.0 draft standard. Here we will describe this architecture and the results of creating and using a prototype implementation of the standard both to integrate existing TCAD tools and to develop simple new tools.
引用
收藏
页码:82 / 95
页数:14
相关论文
共 27 条
[1]  
BONING D, 1992, MAY P NUPAD 4, P199
[2]   THE INTERTOOL PROFILE INTERCHANGE FORMAT - AN OBJECT-ORIENTED APPROACH [J].
BONING, DS ;
HEYTENS, ML ;
WONG, AS .
IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS, 1991, 10 (09) :1150-1156
[3]  
CHIN G, 1991, 3RD P INT S ULSI SCI, P78
[4]   DATA STRUCTURING FOR PROCESS AND DEVICE SIMULATIONS [J].
CORBEX, CH ;
GERODOLLE, AF ;
MARTIN, SP ;
PONCET, AR .
IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS, 1988, 7 (04) :489-500
[5]   AN INTERCHANGE FORMAT FOR PROCESS AND DEVICE SIMULATION [J].
DUVALL, SG .
IEEE TRANSACTIONS ON COMPUTER-AIDED DESIGN OF INTEGRATED CIRCUITS AND SYSTEMS, 1988, 7 (07) :741-754
[6]  
FASCHING F, 1991, 4TH P INT C SIM SEM, P477
[7]  
GILES MD, 1992, MAY P NUPAD 4, P207
[8]   MINIMOS-3 - A MOSFET SIMULATOR THAT INCLUDES ENERGY-BALANCE [J].
HANSCH, W ;
SELBERHERR, S .
IEEE TRANSACTIONS ON ELECTRON DEVICES, 1987, 34 (05) :1074-1078
[9]   ELECTRONIC CAD FRAMEWORKS [J].
HARRISON, DS ;
NEWTON, AR ;
SPICKELMIER, RL ;
BARNES, TJ .
PROCEEDINGS OF THE IEEE, 1990, 78 (02) :393-417
[10]  
KARASICK M, 1919, 1991 ACM S SOL MOD F