DISSOLUTION RATE OF CADMIUM FROM DENTAL GOLD SOLDER ALLOYS

被引：15

作者：

BERGMAN, M

GINSTRUP, O

机构：

[1] UNIV UMEA,DEPT INORG CHEM,UMEA,SWEDEN

[2] UNIV UMEA,DEPT DENT TECHNOL,S-90185 UMEA,SWEDEN

来源：

关键词：

D O I：

10.3109/00016357509027562

中图分类号：

R78 [口腔科学];

学科分类号：

1003 ;

摘要：

引用

页码：199 / 210

页数：12

共 33 条

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