DISSOLUTION RATE OF CADMIUM FROM DENTAL GOLD SOLDER ALLOYS

被引:15
作者
BERGMAN, M
GINSTRUP, O
机构
[1] UNIV UMEA,DEPT INORG CHEM,UMEA,SWEDEN
[2] UNIV UMEA,DEPT DENT TECHNOL,S-90185 UMEA,SWEDEN
关键词
D O I
10.3109/00016357509027562
中图分类号
R78 [口腔科学];
学科分类号
1003 ;
摘要
引用
收藏
页码:199 / 210
页数:12
相关论文
共 33 条
  • [31] SWARTZ MARJORIE L., 1958, JOUR DENTAL RES, V37, P837, DOI 10.1177/00220345580370051101
  • [32] VETTER KJ, 1967, ELECTROCHEMICAL KINE, P119
  • [33] 1972, WHO FOOD ADDITIVES S, P51