THE TRIALS OF WAFER-SCALE INTEGRATION

被引：23

作者：

MCDONALD, JF

ROGERS, EH

ROSE, K

STECKL, AJ

机构：

来源：

关键词：

D O I：

10.1109/MSPEC.1984.6370295

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：32 / 39

页数：8

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