AN ELECTRODEPOSITION TECHNIQUE FOR PRODUCING MULTILAYERS OF NICKEL-PHOSPHORUS AND OTHER ALLOYS

A dual-bath electrodeposition method using two separate plating solutions has been developed for the production of thin-film metal multilayers. The technique has been used to make Ni/NiPx and NiP/NiPy (0 < xy < 25 a/o) multilayers with repeat lengths of 19 angstrom and above. The microstructure of both homogeneous and multilayered deposits indicates that in these systems surface reaction of the film as it is transferred between the electrolytes does not disrupt multilayer formation. The properties of films formed using dual-bath electrodeposition are described and application of the method to other alloy systems is discussed.