DEPOSITION RATE OF METALLIC THIN-FILMS IN REACTIVE SPUTTERING PROCESS

被引：140

作者：

ABE, T ^{[1
]}

YAMASHINA, T ^{[1
]}

机构：

[1] HOKKAIDO UNIV,FAC ENGN,DEPT NUCL ENGN,SAPPORO 060,JAPAN

来源：

关键词：

D O I：

10.1016/0040-6090(75)90300-4

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：19 / 27

页数：9

共 15 条

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