NOVEL, CONVENIENT, LOW-COST ALTERNATIVE METHOD FOR FILM FABRICATION - TITANIUM NITRIDE THIN-FILMS ON ALUMINA SUBSTRATES FOR AUTOMOTIVE APPLICATIONS FROM A MOLECULAR PRECURSOR, (CH3)(3)SINHTICL3

被引：11

作者：

NARULA, CK ^{[1
]}

CZUBAROW, P ^{[1
]}

SEYFERTH, D ^{[1
]}

机构：

[1] FORD MOTOR CO,DEPT CHEM,SCI RES LAB,DEARBORN,MI 48121

来源：

CHEMICAL VAPOR DEPOSITION | 1995年 / 1卷 / 02期

关键词：

D O I：

10.1002/cvde.19950010204

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

The deposition of titanium nitride films on ceramic substrates from tetrahydrofuran solutions of the title precursor is reported. It is demonstrated that the process, which involves a single dip-coat-fire sequence, is a viable alternative to the CVD process currently used, and that it is an economically feasible route for the mass production of porous TiN electrodes.

引用

页码：51 / &

共 34 条

[1]

Arnold W. H., 1989, US Pat., Patent No. [4,820,611, 4820611]

[2] TIN, TIC AND TI(C,N) FILM CHARACTERIZATION AND ITS RELATIONSHIP TO TRIBOLOGICAL BEHAVIOR [J].