MODERN METHODS OF THIN-FILM DEPOSITION

被引：5

作者：

CAMPBELL, DS ^{[1
]}

机构：

[1] LOUGHBOROUGH UNIV TECHNOL,DEPT ELECTR & ELECT ENGN,LOUGHBOROUGH LE11 3TU,LEICESTERSHIRE,ENGLAND

来源：

关键词：

D O I：

10.1016/0040-6090(76)90544-7

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：3 / 10

页数：8

共 35 条

[1]

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[2]

CAMPBELL DS, 1975, P C PHYSICS NONMETAL

[3]

Dell'Oca C., 1971, PHYS THIN FILMS, P1

[4] INFLUENCE OF TARGET MATERIAL ON SPUTTER ETCHING PROCESSES [J].

DIMIGEN, H ;

LUTHJE, H .

[5]

Feist W.M., 1969, Physics of Thin Films, V5, P237

[6]

FELDSTEIN N, 1973, SOLID STATE TECHNOL, V16, P87

[7]

Feldstein N., 1974, Plating, V61, P146

[8]

Glang R., 1970, HDB THIN FILM TECHNO

[9]

GREGOR VV, 1966, PHYS THIN FILMS, V3, P131

[10]

GREINER JH, 1974, J APPL PHYS, V45, P32, DOI 10.1063/1.1662979