HIGH-PRECISION MOS CURRENT MIRROR

被引:6
作者
AKIYA, M
NAKASHIMA, S
机构
来源
IEE PROCEEDINGS-I COMMUNICATIONS SPEECH AND VISION | 1984年 / 131卷 / 05期
关键词
D O I
10.1049/ip-i-1.1984.0043
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
SEMICONDUCTOR DEVICES, MOS
引用
收藏
页码:170 / 175
页数:6
相关论文
共 13 条
[1]   HIGH-VOLTAGE BURIED-CHANNEL MOS FABRICATED BY OXYGEN IMPLANTATION INTO SILICON [J].
AKIYA, M ;
OHWADA, K ;
NAKASHIMA, S .
ELECTRONICS LETTERS, 1981, 17 (18) :640-641
[2]  
AKIYA M, 1982, 14TH C SOL STAT DEV, P57
[3]   GRAPHICAL ANALYSIS OF MATCHED TRANSISTOR CURRENT SINKS SOURCES [J].
ALLEN, PE .
IEEE JOURNAL OF SOLID-STATE CIRCUITS, 1974, SC 9 (01) :31-35
[4]   CMOS DEVICES FABRICATED ON BURIED SIO2 LAYERS FORMED BY OXYGEN IMPLANTATION INTO SILICON [J].
IZUMI, K ;
DOKEN, M ;
ARIYOSHI, H .
ELECTRONICS LETTERS, 1978, 14 (18) :593-594
[5]   HIGH OUTPUT RESISTANCE CURRENT SOURCE [J].
JAEGER, RC .
IEEE JOURNAL OF SOLID-STATE CIRCUITS, 1974, SC 9 (04) :192-194
[6]   HIGH-VOLTAGE SUBSCRIBER LINE INTERFACE LSIS [J].
KAWARADA, K ;
HAYASHI, T ;
INABE, Y ;
IMAGAWA, H .
IEEE JOURNAL OF SOLID-STATE CIRCUITS, 1982, 17 (06) :1144-1149
[7]  
MAEDA Y, 1983, NAT CONV RECORD, V550
[8]   ELECTRIC-FIELD-SHIELDING LAYERS FORMED BY OXYGEN IMPLANTATION INTO SILICON [J].
NAKASHIMA, S ;
AKIYA, M ;
KATO, K .
ELECTRONICS LETTERS, 1983, 19 (15) :568-570
[9]  
NISHIUCHI K, 1978, IEDM TECH DIG, P26
[10]  
Ohwada K., 1980, International Electron Devices Meeting. Technical Digest, P756