CHARACTERIZATION OF IN-BASED EUTECTIC ALLOYS USED IN JOSEPHSON PACKAGING

被引：15

作者：

YEH, JTC

机构：

来源：

METALLURGICAL TRANSACTIONS A-PHYSICAL METALLURGY AND MATERIALS SCIENCE | 1982年 / 13卷 / 09期

关键词：

D O I：

10.1007/BF02644794

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

页码：1547 / 1562

页数：16

共 13 条

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[4]

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[5]

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[6]

SMITH JF, 1974, MATER ENG, V80, P76

[7] CONTROLLED COLLAPSE REFLOW FOR JOSEPHSON CHIP BONDING [J].

TING, CY ;

GREBE, K ;

WALDMAN, D .

[8]

TING CY, 1979, COMMUNICATION

[9]

WALDMAN D, 1979, UNPUB

[10]

WELEFF W, 1965, ADVANCES CRYOGENIC E, V10, P50