CONTROLLED COLLAPSE REFLOW FOR JOSEPHSON CHIP BONDING

被引：7

作者：

TING, CY

GREBE, K

WALDMAN, D

机构：

来源：

JOURNAL OF THE ELECTROCHEMICAL SOCIETY | 1982年 / 129卷 / 04期

关键词：

D O I：

10.1149/1.2123988

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

引用

页码：859 / 864

页数：6

共 13 条

[1] OVERVIEW OF MATERIALS AND PROCESS ASPECTS OF JOSEPHSON INTEGRATED-CIRCUIT FABRICATION [J].

AMES, I .

IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1980, 24 (02) :188-194

[2] JOSEPHSON COMPUTER-TECHNOLOGY - IBM RESEARCH-PROJECT [J].

ANACKER, W .

IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1980, 24 (02) :107-112

[3]

ANACKER W, 1979, IEEE SPECTRUM MAY

[4] STUDIES OF SLT CHIP TERMINAL METALLURGY [J].

BERRY, BS ;

AMES, I .

IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1969, 13 (03) :286-&

[5] OVERVIEW OF JOSEPHSON PACKAGING [J].

BROWN, AV .

IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1980, 24 (02) :167-171

[6] GEOMETRIC OPTIMIZATION OF CONTROLLED COLLAPSE INTERCONNECTIONS [J].

GOLDMANN, LS .

IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1969, 13 (03) :251-&

[7] FABRICATION PROCESS FOR JOSEPHSON INTEGRATED-CIRCUITS [J].

GREINER, JH ;

KIRCHER, CJ ;

KLEPNER, SP ;

LAHIRI, SK ;

WARNECKE, AJ ;

BASAVAIAH, S ;

YEN, ET ;

BAKER, JM ;

BROSIOUS, PR ;

HUANG, HCW ;

MURAKAMI, M ;

AMES, I .

IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1980, 24 (02) :195-205

[8] CHARACTERISTICS OF CHIP-TO-CHIP SIGNAL PROPAGATION IN A PACKAGE SUITABLE FOR SUPERCONDUCTING CIRCUITS [J].

JONES, HC ;

HERRELL, DJ .

IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1980, 24 (02) :172-177

[9] CONTROLLED COLLAPSE REFLOW CHIP JOINING [J].

MILLER, LF .

IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1969, 13 (03) :239-&

[10] RELIABILITY OF CONTROLLED COLLAPSE INTERCONNECTIONS [J].

NORRIS, KC ;

LANDZBERG, AH .

IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1969, 13 (03) :266-+

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