LOW REGROWTH-INTERFACE RECOMBINATION RATES IN INGAAS-GAAS BURIED RIDGE LASERS FABRICATED BY IN-SITU PROCESSING

被引:16
作者
STRAND, TA
THIBEAULT, BJ
MUI, DSL
COLDREN, LA
PETROFF, PM
HU, EL
机构
[1] Univ of California-Santa Barbara, Santa Barbara, United States
关键词
D O I
10.1063/1.113292
中图分类号
O59 [应用物理学];
学科分类号
摘要
We report the use of low damage dry etching and in situ molecular beam epitaxial (MBE) regrowth in creating high-quality regrown interfaces. By fabricating buried, etched ridge InGaAs/GaAs lasers, we are able to measure the interface recombination portion of the threshold current and extract the interface recombination velocity. We find that a two-part etching process composed of ion beam assisted etching and chlorine gas etching, followed by in situ MBE regrowth, results in a very low interface recombination velocity of 3×103 cm/s.© 1995 American Institute of Physics.
引用
收藏
页码:1966 / 1968
页数:3
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