MATERIAL AND PROCESSING TECHNOLOGIES OF POLYIMIDE FOR ADVANCED ELECTRONIC DEVICES

被引：13

作者：

ENDO, A

TAKADA, M

ADACHI, K

TAKASAGO, H

YADA, T

ONISHI, Y

机构：

来源：

JOURNAL OF THE ELECTROCHEMICAL SOCIETY | 1987年 / 134卷 / 10期

关键词：

ELECTRONIC EQUIPMENT - Materials - HYDRAZINE - INTEGRATED CIRCUIT MANUFACTURE - Materials - PLASTICS FILMS - Applications;

D O I：

10.1149/1.2100235

中图分类号：

O646 [电化学、电解、磁化学];

学科分类号：

081704 ;

摘要：

Advanced material and processing technologies of polyimide applied to various substrates were investigated and studied for high density electronic devices. Precisely controlled temperature profiles in each processing step can realize required chemical structures of polyimide materials and the excellent polyimide films. Thick film patterning of photosensitive polyimide is extremely difficult because the exposed top layer is dissolved before the unexposed area is developed as the result of UV absorption and reaction at the bottom being less than that of the top layer. For removing the thin film residue on copper and/or copper containing alloys, a simple patterning process using a solution containing hydrazine has been developed. Newly developed techniques such as screen printing, shower developing, and microwave-assisted curing enable the realization of more precise patterning of photosensitive polyimide.

引用

页码：2522 / 2527

页数：6

共 8 条

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