THERMAL AND PHYSICAL-PROPERTIES AND ETCHING CHARACTERISTICS OF PI FILMS

被引:18
作者
ENDO, A
YADA, T
机构
关键词
D O I
10.1149/1.2113752
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
引用
收藏
页码:155 / 158
页数:4
相关论文
共 9 条
  • [1] A NOVEL POLYIMIDE FILM PREPARATION AND ITS PREFERENTIAL-LIKE CHEMICAL ETCHING TECHNIQUES FOR GAAS DEVICES
    HARADA, Y
    MATSUMOTO, F
    NAKAKADO, T
    [J]. JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1983, 130 (01) : 129 - 134
  • [2] NOVEL BEAM LEAD GAAS SCHOTTKY-BARRIER DIODE FABRICATED BY USING THICK POLYIMIDE FILM
    HARADA, Y
    FUKUDA, H
    [J]. IEEE TRANSACTIONS ON ELECTRON DEVICES, 1979, 26 (11) : 1799 - 1804
  • [3] MOLECULAR AGGREGATION OF SOLID AROMATIC POLYMERS .1. SMALL-ANGLE X-RAY-SCATTERING FROM AROMATIC POLYIMIDE FILM
    ISODA, S
    SHIMADA, H
    KOCHI, M
    KAMBE, H
    [J]. JOURNAL OF POLYMER SCIENCE PART B-POLYMER PHYSICS, 1981, 19 (09) : 1293 - 1312
  • [4] KAMBE H, 1972, ZAIRYO, V21, P405
  • [5] KAZARYAN LG, 1972, VYSOKOMOL SOEDIN A, V14, P1199
  • [6] KOCHI M, 1980, POLYM PREPR JPN, V29, P2095
  • [7] NEVON JH, 1981, MICROELECTRON RELIAB, V21, P669
  • [8] NOVEL PLANAR MULTILEVEL INTERCONNECTION TECHNOLOGY UTILIZING POLYIMIDE
    SATO, K
    HARADA, S
    SAIKI, A
    KIMURA, T
    OKUBO, T
    MUKAI, K
    [J]. IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1973, PHP9 (03): : 176 - 180
  • [9] WADA Y, 1976, BUSSEI KOGAKU KOZA, P144