EFFECT OF SURFACE PLASMA TREATMENT ON THE CHEMICAL, PHYSICAL, MORPHOLOGICAL, AND MECHANICAL-PROPERTIES OF TOTALLY ABSORBABLE BONE INTERNAL-FIXATION DEVICES

The purpose of this work was threefold: to enhance the adhesion between the reinforced absorbable calcium phosphate (Cap) fibers and the absorbable polyglycolide acid (PGA) matrix, to improve the hydrolytic degradation of the CaP fibers, and preliminarily to evaluate the cytotoxicity of the plasma treated surface of CaP fibers. A CH4 plasma treatment was used to achieve these goals. The microbond method was used to evaluate the effects of the plasma treatment on the interfacial shear strength between the PGA matrix and CaP fibers. The treatment increased the mean interfacial shear strength of the CaP/PGA composite system by 30%. AFM data showed that CH4-treated CaP fibers had considerable microscopic surface roughness, which facilitated mechanical interlocking between the reinforced CaP fibers and PGA matrix. The untreated and plasma-treated fibers were also subjected to in vitro hydrolytic degradation in a phosphate buffer solution of pH 7.44 at 37 degrees C for up to 15 h. CH4 plasma treatment resulted in a considerable lower polar term of the surface energy and a significantly higher disperse term in water media. This change in the proportion of surface energy terms may reduce the capillary wicking phenomena of water through the CaP fiber/PGA matrix interface. The CaP fiber dissolution studies revealed that both CH4 and Parylene plasma polymer coatings appeared to reduce the solubility of CaP fibers, and that the magnitude of reduction was higher in an acidic than a physiologic pH environment. A preliminary cytotoxicity test revealed that both CH4 and Parylene plasma-treated CaP fibers were noncytotoxic. Additional research should be done to determine the optimum plasma conditions and the possible use of other plasma gases to improve the interfacial shear stress of the composite and the dissolution properties of CaP fibers. (C) 1994 John Wiley and Sons, Inc.