THE APPLICATION OF REACTIVE ION ETCHING IN PRODUCING FREESTANDING MICROSTRUCTURES AND ITS EFFECTS ON LOW-TEMPERATURE ELECTRICAL TRANSPORT

被引：11

作者：

KWONG, YK ^{[1
]}

LIN, K ^{[1
]}

HAKONEN, P ^{[1
]}

PARPIA, JM ^{[1
]}

ISAACSON, M ^{[1
]}

机构：

[1] CORNELL UNIV,DEPT PHYS,ITHACA,NY 14853

来源：

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B | 1989年 / 7卷 / 06期

关键词：

D O I：

10.1116/1.584670

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：2020 / 2024

页数：5

共 17 条

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