EFFECTS OF INTERFACIAL FILMS ON THERMAL-STRESSES IN WHISKER-REINFORCED CERAMICS

被引:58
作者
HSUEH, CH
BECHER, PF
ANGELINI, P
机构
关键词
D O I
10.1111/j.1151-2916.1988.tb07560.x
中图分类号
TQ174 [陶瓷工业]; TB3 [工程材料学];
学科分类号
0805 ; 080502 ;
摘要
引用
收藏
页码:929 / 933
页数:5
相关论文
共 21 条
[1]  
AHAIM R, 1987, ADV CERAM MATER, V2, P154
[2]  
ANGELINI P, 1986, 44TH P ANN M EL MICR, P498
[3]  
ANGELINI P, 1987, P MATER RES SOC, V78, P241
[4]  
BECHER PF, 1988, ADV CERAM MATER, V3, P148
[5]  
BECHER PF, IN PRESS J AM CERAM
[6]  
BECHER PF, 1986, FRACTURE MECHANISMS, P61
[7]   THERMOMECHANICAL MISMATCH IN CERAMIC-FIBER-REINFORCED GLASS-CERAMIC COMPOSITES [J].
BOROM, MP ;
JOHNSON, CA .
JOURNAL OF THE AMERICAN CERAMIC SOCIETY, 1987, 70 (01) :1-8
[8]  
Evans AG, 1980, THERMAL STRESSES SEV, P629, DOI [10.1007/978-1-4613-3156-8_39, DOI 10.1007/978-1-4613-3156-8_39]
[9]   OXIDATION INDUCED STRESSES AND SOME EFFECTS ON THE BEHAVIOR OF OXIDE-FILMS [J].
HSUEH, CH ;
EVANS, AG .
JOURNAL OF APPLIED PHYSICS, 1983, 54 (11) :6672-6686
[10]   RESIDUAL-STRESSES AND CRACKING IN METAL CERAMIC SYSTEMS FOR MICROELECTRONICS PACKAGING [J].
HSUEH, CH ;
EVANS, AG .
JOURNAL OF THE AMERICAN CERAMIC SOCIETY, 1985, 68 (03) :120-127