EXPANDED CONTACTS AND INTERCONNEXIONS TO MONOLITHIC SILICON INTEGRATED CIRCUITS

被引：50

作者：

CUNNINGHAM, JA

机构：

来源：

关键词：

D O I：

10.1016/0038-1101(65)90061-4

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：735 / +

页数：1

共 29 条

[1] TECHNIQUE FOR CONNECTING ELECTRICAL LEADS TO SEMICONDUCTORS
ANDERSON, OL
CHRISTENSEN, H
ANDREATCH, P
[J]. JOURNAL OF APPLIED PHYSICS, 1957, 28 (08) : 923 - 923
[2] SIMPLE, RAPID SPUTTERING APPARATUS
BELSER, RB
HICKLIN, WH
[J]. REVIEW OF SCIENTIFIC INSTRUMENTS, 1956, 27 (05) : 293 - 296
[3] ALLOYING BEHAVIOR OF THIN BIMETAL FILMS, SIMULTANEOUSLY OR SUCCESSIVELY DEPOSITED
BELSER, RB
[J]. JOURNAL OF APPLIED PHYSICS, 1960, 31 (03) : 562 - 570
[4] BELSER RB, 7 US SIGN CORPS ENG
[5] BELSER RB, DA36039SC42453
[6] BELSER RB, 163176 US SIGN CORPS
[7] ADHESION OF EVAPORATED METAL FILMS ON GLASS
BENJAMIN, P
WEAVER, C
[J]. PROCEEDINGS OF THE ROYAL SOCIETY OF LONDON SERIES A-MATHEMATICAL AND PHYSICAL SCIENCES, 1961, 261 (1304) : 516 - +
[8] MEASUREMENT OF ADHESION OF THIN FILMS
BENJAMIN, P
WEAVER, C
[J]. PROCEEDINGS OF THE ROYAL SOCIETY OF LONDON SERIES A-MATHEMATICAL AND PHYSICAL SCIENCES, 1960, 254 (1277): : 163 - 176
[9] BERNSTEIN L, 1961, SEMICONDUCTOR PROD, P34
[10] Coffinberry AS, 1938, T AM I MIN MET ENG, V128, P249