RESIDUAL-STRESSES AND CRACKING IN METAL CERAMIC SYSTEMS FOR MICROELECTRONICS PACKAGING

被引：75

作者：

HSUEH, CH

EVANS, AG

机构：

[1] Univ of California, Berkeley, Dep of, Materials Science & Mineral, Engineering, Berkeley, CA, USA, Univ of California, Berkeley, Dep of Materials Science & Mineral Engineering, Berkeley, CA, USA

来源：

JOURNAL OF THE AMERICAN CERAMIC SOCIETY | 1985年 / 68卷 / 03期

关键词：

ELECTRONICS PACKAGING - Materials;

D O I：

10.1111/j.1151-2916.1985.tb09648.x

中图分类号：

TQ174 [陶瓷工业]; TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

Residual stresses that develop in a metal/ceramic system due to thermal expansion mismatch were calculated for a work-hardening metal. The calculations were conducted for a cylindrical configuration, pertinent to certain microelectronics packaging systems. Experimental measurements of the stress have also been made on a Cu/cordierite ceramic system, using an indentation technique. It is shown that porosity in the metal can plastically expand and provide a mode of dilatational relaxation.

引用

页码：120 / 127

页数：8