LOW-TEMPERATURE OXIDATION BEHAVIOR OF REACTIVELY SPUTTERED TIN BY X-RAY PHOTOELECTRON-SPECTROSCOPY AND CONTACT RESISTANCE MEASUREMENTS

被引：134

作者：

ERNSBERGER, C ^{[1
]}

NICKERSON, J ^{[1
]}

SMITH, T ^{[1
]}

机构：

[1] UNIV NOTRE DAME,NOTRE DAME,IN 46556

来源：

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS | 1986年 / 4卷 / 06期

关键词：

D O I：

10.1116/1.573679

中图分类号：

TB3 [工程材料学];

学科分类号：

0805 ; 080502 ;

摘要：

引用

页码：2784 / 2788

页数：5

共 10 条

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ERNSBERGER, C
NICKERSON, J
MILLER, A
BANKS, D
[J]. JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1985, 3 (06): : 2303 - 2307
[4] GRAY TJ, 1957, DEFECT SOLID STATE, P144
[5] HAUFFE K, 1965, OXIDATION METALS, P2
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[7] QUANTITATIVE CHEMICAL-ANALYSIS BY ESCA
PENN, DR
[J]. JOURNAL OF ELECTRON SPECTROSCOPY AND RELATED PHENOMENA, 1976, 9 (01) : 29 - 40
[8] Wagner C., 1979, HDB XRAY PHOTOELECTR, P68, DOI [10.1002/sia.740030412, DOI 10.1002/SIA.740030412]
[9] OXIDATION-KINETICS OF TIN THIN-FILMS
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NOSER, J
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[J]. JOURNAL OF APPLIED PHYSICS, 1981, 52 (11) : 6659 - 6664
[10] 1971, PHYSICAL DESIGN ELEC, V3, P471