TEMPERATURE DISTRIBUTION DURING HEATING USING A HIGH REPETITION RATE PULSED LASER

被引：26

作者：

HABA, B

HUSSEY, BW

GUPTA, A

机构：

[1] IBM Thomas J. Watson Research Center, Yorktown Heights

来源：

JOURNAL OF APPLIED PHYSICS | 1991年 / 69卷 / 05期

关键词：

D O I：

10.1063/1.348595

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

A general equation has been derived for computing the temperature distribution produced in a substrate heated by a high repetition rate pulsed laser. The theoretical predictions have been compared with experimental results obtained for etching of Mn-Zn ferrite in KOH solution using a copper vapor laser. The effects of the laser power and substrate scan speed on the temperature distribution have been investigated, and the predicted melt-zone boundaries have been compared with the experimentally observed width, depth, and shape of the etched grooves.

引用

页码：2871 / 2876

页数：6

共 7 条

[1]

BAUERLE D, 1986, CHEM PROCESSING LASE, V1

[2]

CARSLAW HS, 1959, CONDUCTION HEAT SOLI, P371

[3] TEMPERATURE RISE INDUCED BY A LASER-BEAM [J].