DETERMINING SI1-XGEX LAYER THICKNESS AND COMPOSITION BY ELLIPSOMETRY

被引:4
作者
KAMINS, TI
机构
[1] Hewlett-Packard Company, Palo Alto
关键词
OPTICAL MEASUREMENT; SEMICONDUCTOR MATERIALS TESTING;
D O I
10.1049/el:19910285
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
The thickness and composition of Si(1-x)Ge(x) layers deposited on silicon substrates can be determined by optical ellipsometry after suitable calibration by other means, such as Rutherford backscattering. The technique is sensitive to a few tenths of a nanometre native oxide on the surface of the Si(1-x)Ge(x) layer (primarily affecting DELTA), and this oxide must be considered in using the technique.
引用
收藏
页码:451 / 452
页数:2
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