LASER-CONTROLLED WET CHEMICAL ETCHING FOR CORRECTIVE TRIMMING OF THIN-FILMS - APPLICATION TO ALUMINUM

被引:5
作者
TSAO, JY [1 ]
EHRLICH, DJ [1 ]
机构
[1] MIT,LINCOLN LAB,LEXINGTON,MA 02173
关键词
D O I
10.1149/1.2108382
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
9
引用
收藏
页码:2244 / 2248
页数:5
相关论文
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