EXPERIMENTAL STUDY OF LASER FORMED CONNECTIONS FOR LSI WAFER PERSONALIZATION

被引：18

作者：

KUHN, L

SCHUSTER, SE

ZORY, PS

LYNCH, GW

PARRISH, JT

机构：

[1] IBM CORP,TJ WATSON RES CTR,YORKTOWN HTS,NY 10598

[2] IBM CORP,TJ WATSON RES CTR,APPL RES DEPT,YORKTOWN HTS,NY 10598

来源：

IEEE JOURNAL OF SOLID-STATE CIRCUITS | 1975年 / 10卷 / 04期

关键词：

D O I：

10.1109/JSSC.1975.1050597

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：219 / 228

页数：10

共 8 条

[1]

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[3] CONNECTIONS AND DISCONNECTIONS ON INTEGRATED-CIRCUITS USING NANOSECOND LASER PULSES [J].

COOK, PW ;

SCHUSTER, SE ;

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APPLIED PHYSICS LETTERS, 1975, 26 (03) :124-126

[4] MATERIALS PROCESSING WITH LASERS [J].

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IEEE SPECTRUM, 1972, 9 (04) :62-&

[5] LASERS IN INDUSTRY [J].

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WATKINS, LS .

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[6] METALLURGICAL PROPERTIES AND ELECTRICAL CHARACTERISTICS OF PALLADIUM SILICIDE-SILICON CONTACTS [J].

KIRCHER, CJ .

SOLID-STATE ELECTRONICS, 1971, 14 (06) :507-+

[7]

KUHN L, 1974, IEEE INT ELECTRON DE, P357

[8] FAST MODULATOR FOR EXTRACTION OF INTERNAL LASER POWER [J].

MAYDAN, D .

JOURNAL OF APPLIED PHYSICS, 1970, 41 (04) :1552-&

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