MICROVOID GROWTH AND FAILURE IN THE LIGAMENT BETWEEN A HOLE AND A BLUNT CRACK TIP

被引：98

作者：

ARAVAS, N ^{[1
]}

MCMEEKING, RM ^{[1
]}

机构：

[1] UNIV ILLINOIS,DEPT THEORET & APPL MECH,URBANA,IL 61801

来源：

INTERNATIONAL JOURNAL OF FRACTURE | 1985年 / 29卷 / 01期

关键词：

D O I：

10.1007/BF00020674

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

PLATES

引用

页码：21 / 38

页数：18

共 42 条

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