ELECTROCHEMICAL AND METALLURGICAL ASPECTS OF LASER-ENHANCED JET PLATING OF GOLD

被引:16
作者
GELCHINSKI, MH
ROMANKIW, LT
VIGLIOTTI, DR
VONGUTFELD, RJ
机构
[1] IBM, Thomas J. Watson Research Cent,, Yorktown Heights, NY, USA, IBM, Thomas J. Watson Research Cent, Yorktown Heights, NY, USA
关键词
D O I
10.1149/1.2113627
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
12
引用
收藏
页码:2575 / 2581
页数:7
相关论文
共 12 条
[1]  
Despic A.R., 1972, MOD ASPECTS ELECTROC, V7, P199, DOI [10.1007/978-1-4684-3003-5_4, DOI 10.1007/978-1-4684-3003-5_4]
[2]  
GELCHINSKI MH, 1982, EL SOC EXT ABSTR, V2, P206
[3]  
IBL N, 1962, ADV ELECTROCHEM ELEC, V2, P49
[4]   LASER-ENHANCED ELECTROPLATING ON GOOD HEAT-CONDUCTING BULK MATERIALS [J].
KUIKEN, HK ;
MIKKERS, FEP ;
WIERENGA, PE .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1983, 130 (03) :554-558
[5]   INVESTIGATION OF LASER-ENHANCED ELECTROPLATING MECHANISMS [J].
PUIPPE, JC ;
ACOSTA, RE ;
VONGUTFELD, RJ .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1981, 128 (12) :2539-2545
[6]  
ROMANKIW LT, 1983, ELECTROCHEMICAL SOC, P66
[7]  
VONGUTFELD RJ, 1979, APPL PHYS LETT, V34, P617, DOI 10.1063/1.90637
[8]   LASER-ENHANCED JET PLATING - A METHOD OF HIGH-SPEED MASKLESS PATTERNING [J].
VONGUTFELD, RJ ;
GELCHINSKI, MH ;
ROMANKIW, LT ;
VIGLIOTTI, DR .
APPLIED PHYSICS LETTERS, 1983, 43 (09) :876-878
[9]  
VONGUTFELD RJ, 1983, P SOC PHOTO-OPT INST, V385, P118, DOI 10.1117/12.934964
[10]   LASER-ENHANCED PLATING AND ETCHING - MECHANISMS AND APPLICATIONS [J].
VONGUTFELD, RJ ;
ACOSTA, RE ;
ROMANKIW, LT .
IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1982, 26 (02) :136-144