SELECTIVITY AND COPPER CHEMICAL VAPOR-DEPOSITION

被引:84
作者
DUBOIS, LH
ZEGARSKI, BR
机构
[1] AT&T Bell Laboratories, Murray Hill
关键词
chemical vapour deposition; copper; high-temperature effects; metallic thin films; nucleation hydrogen bonds; sorption;
D O I
10.1149/1.2069070
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
The question of selectivity (on metal vs. insulator) in the growth of copper thin films from organometallic precursors is addressed by studying the adsorption of Cu(hfac)(vtms) (where hfac = 1,1,1,5,5,5-hexafluoroacetylacetonate and vtms = vinyltrimethylsilane) on high surface area silica using transmission infrared spectroscopy. No deposition is observed on dehydrated SiO2. In the presence of adsorbed, hydrogen bonded OH (OD) groups (from the dissociative adsorption of either water or ethanol-d6), thin film growth is nucleated and selectivity is lost. In addition, temperature-programmed desorption is employed to study the bonding of a number of neutral ligands to Cu(100). This information is then used to correlate the activation energy for desorption with the observed selectivity of a series of Cu(I) beta-diketonates.
引用
收藏
页码:3295 / 3299
页数:5
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