ADHESION OF COPPER-FILMS TO ALUMINUM-OXIDE USING A SPINEL STRUCTURE INTERFACE

被引：34

作者：

KATZ, G ^{[1
]}

机构：

[1] IBM CORP,THOMAS J WATSON RES CTR,YORKTOWN HTS,NY 10598

来源：

THIN SOLID FILMS | 1976年 / 33卷 / 01期

关键词：

D O I：

10.1016/0040-6090(76)90591-5

中图分类号：

T [工业技术];

学科分类号：

08 ;

摘要：

引用

收藏

页码：99 / 105

页数：7

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