DEPENDENCY OF ADHESION BEHAVIOR ON THERMAL-STRESS DISTRIBUTION IN PHOTORESIST MICROPATTERNS

被引：3

作者：

KAWAI, A ^{[1
]}

NAGATA, H ^{[1
]}

TAKATA, M ^{[1
]}

机构：

[1] NAGAOKA UNIV TECHNOL,DEPT ELECT ENGN,NAGAOKA,NIIGATA 94021,JAPAN

来源：

JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS | 1993年 / 32卷 / 02期

关键词：

ADHESION; THERMAL STRESS; RHEOLOGY; FINITE ELEMENT MODELING; PHOTORESIST; TENSILE STRESS; STRESS CONCENTRATION; LITHOGRAPHY; INTRUSION; ELASTICITY;

D O I：

10.1143/JJAP.32.1020

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

We report an excellent correlation between adhesive behavior in HF aqueous solution and internal distribution of thermal stress in a photoresist pattern. The stress distribution was analyzed using the two-dimensional finite element modeling in the cross section of the photoresist pattern. The large envelope shape, which indicates weak adhesion, was confirmed by the concentration of stress at the resist-substrate interface. In particular, the hardened layer of the photoresist pattern surface has the effect of forming the two-step shape of the etching envelope due to isotropic and lateral intrusion.

引用

页码：1020 / 1024

页数：5

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