A THERMAL MODULE DESIGN FOR ADVANCED PACKAGING

被引：33

作者：

HWANG, LT

TURLIK, I

REISMAN, A

机构：

[1] N CAROLINA STATE UNIV,DEPT ELECT & COMP ENGN,RALEIGH,NC 27650

[2] MICROELECTR CTR N CAROLINA,BELL NO RES,RES TRIANGLE PK,NC 27709

来源：

关键词：

D O I：

10.1007/BF02657910

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

引用

页码：347 / 355

页数：9

共 26 条

[1] Baumeister T., 1978, MARKS STANDARD HDB M
[2] THERMAL CONDUCTION MODULE - A HIGH-PERFORMANCE MULTILAYER CERAMIC PACKAGE
BLODGETT, AJ
BARBOUR, DR
[J]. IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1982, 26 (01) : 30 - 36
[3] BLODGETT AJ, 1983, SCI AM JUL
[4] CARSLAW HS, 1959, CONDUCTION HEAT SOLI
[5] CONDUCTION COOLING FOR AN LSI PACKAGE - A ONE-DIMENSIONAL APPROACH
CHU, RC
HWANG, UP
SIMONS, RE
[J]. IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 1982, 26 (01) : 45 - 54
[6] DESIGN OF ION-IMPLANTED MOSFETS WITH VERY SMALL PHYSICAL DIMENSIONS
DENNARD, RH
GAENSSLEN, FH
YU, HN
RIDEOUT, VL
BASSOUS, E
LEBLANC, AR
[J]. IEEE JOURNAL OF SOLID-STATE CIRCUITS, 1974, SC 9 (05) : 256 - 268
[7] Dongarra JJ, 1979, LINPACK USERS GUIDE
[8] FOX, 1985, INTRO FLUID MECHANIC, P362
[9] GEBHART B, 1971, HEAT TRANSFER, P48
[10] GRIFFEL W, 1968, PLATE FORMULAS