学术探索
学术期刊
新闻热点
数据分析
智能评审
立即登录
COMMENTS ON ALECKS STRESS-DISTRIBUTION IN CLAMPED PLATES
被引:32
作者
:
BLECH, IA
论文数:
0
引用数:
0
h-index:
0
机构:
IBM CORP,THOMAS J WATSON RES CTR,YORKTOWN HTS,NY 10598
IBM CORP,THOMAS J WATSON RES CTR,YORKTOWN HTS,NY 10598
BLECH, IA
[
1
]
LEVI, AA
论文数:
0
引用数:
0
h-index:
0
机构:
IBM CORP,THOMAS J WATSON RES CTR,YORKTOWN HTS,NY 10598
IBM CORP,THOMAS J WATSON RES CTR,YORKTOWN HTS,NY 10598
LEVI, AA
[
1
]
机构
:
[1]
IBM CORP,THOMAS J WATSON RES CTR,YORKTOWN HTS,NY 10598
来源
:
JOURNAL OF APPLIED MECHANICS-TRANSACTIONS OF THE ASME
|
1981年
/ 48卷
/ 02期
关键词
:
D O I
:
10.1115/1.3157642
中图分类号
:
O3 [力学];
学科分类号
:
08 ;
0801 ;
摘要
:
引用
收藏
页码:442 / 445
页数:4
相关论文
共 2 条
[1]
ALECK BJ, 1949, ASME J APPLIED MECHA, V16, P118
[2]
STRESSES AND STRAINS IN A PLATE BONDED TO A SUBSTRATE - SEMICONDUCTOR DEVICES
ZEYFANG, R
论文数:
0
引用数:
0
h-index:
0
ZEYFANG, R
[J].
SOLID-STATE ELECTRONICS,
1971,
14
(10)
: 1035
-
+
←
1
→
共 2 条
[1]
ALECK BJ, 1949, ASME J APPLIED MECHA, V16, P118
[2]
STRESSES AND STRAINS IN A PLATE BONDED TO A SUBSTRATE - SEMICONDUCTOR DEVICES
ZEYFANG, R
论文数:
0
引用数:
0
h-index:
0
ZEYFANG, R
[J].
SOLID-STATE ELECTRONICS,
1971,
14
(10)
: 1035
-
+
←
1
→