STRESSES AND STRAINS IN A PLATE BONDED TO A SUBSTRATE - SEMICONDUCTOR DEVICES

被引：45

作者：

ZEYFANG, R

机构：

来源：

SOLID-STATE ELECTRONICS | 1971年 / 14卷 / 10期

关键词：

D O I：

10.1016/0038-1101(71)90172-9

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

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页码：1035 / +

页数：1

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