OPTIMIZATION OF TRANSIENT TEMPERATURE UNIFORMITY IN RTP SYSTEMS

被引：25

作者：

NORMAN, SA

机构：

[1] Information Systems Laboratory, Department of Electrical Engineering, Stanford University, Stanford, CA

来源：

IEEE TRANSACTIONS ON ELECTRON DEVICES | 1992年 / 39卷 / 01期

关键词：

D O I：

10.1109/16.108233

中图分类号：

TM [电工技术]; TN [电子技术、通信技术];

学科分类号：

0808 ; 0809 ;

摘要：

Independent, dynamic control of multiple lamps in a rapid thermal processing (RTP) system is a potential solution to the problem of transient wafer temperature nonuniformity. This brief presents a technique based on linear programming for minimization of worst case error during temperature trajectory following, given a model of an axisymmetric, multi-lamp RTP system.

引用

页码：205 / 207

页数：3

共 10 条

[1]

APTE PP, 1991, MAT RES SOC P, V224

[2] STEADY-STATE THERMAL UNIFORMITY AND GAS-FLOW PATTERNS IN A RAPID THERMAL-PROCESSING CHAMBER [J].

CAMPBELL, SA ;

AHN, KH ;

KNUTSON, KL ;

LIU, BYH ;

LEIGHTON, JD .

IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 1991, 4 (01) :14-20

[3]

Chvatal V, 1983, LINEAR PROGRAMMING

[4]

Franklin GF, 1997, DIGITAL CONTROL DYNA

[5]

HILL C, 1983, REDUCED THERMAL PROC, P143

[6]

KAKOSCHKE R, 1991, APPL PHYS A-MATER, V52, P52

[7] THERMAL AND STRESS-ANALYSIS OF SEMICONDUCTOR WAFERS IN A RAPID THERMAL-PROCESSING OVEN [J].

LORD, HA .

IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 1988, 1 (03) :105-114

[8]

NORMAN SA, 1991, 91SAN1 STANF U DEP E

[9]

NORMAN SA, 1991, MATER RES SOC P, V224

[10]

Sparrow E.M., 1978, RAD HEAT TRANSFER

← 1 →