SUB-MICRON, VACUUM ULTRAVIOLET CONTACT LITHOGRAPHY WITH AN F2 EXCIMER LASER

被引：38

作者：

WHITE, JC

CRAIGHEAD, HG

HOWARD, RE

JACKEL, LD

BEHRINGER, RE

EPWORTH, RW

HENDERSON, D

SWEENEY, JE

机构：

来源：

APPLIED PHYSICS LETTERS | 1984年 / 44卷 / 01期

关键词：

D O I：

10.1063/1.94589

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

引用

页码：22 / 24

页数：3

共 7 条

[1] TRILEVEL LIFT-OFF PROCESS FOR REFRACTORY-METALS [J].

GRABBE, P ;

HU, EL ;

HOWARD, RE .

JOURNAL OF VACUUM SCIENCE & TECHNOLOGY, 1982, 21 (01) :33-35

[2] COPOLYMERS OF METHYL-METHACRYLATE AND METHACRYLIC-ACID AND THEIR METAL-SALTS AS RADIATION SENSITIVE RESISTS [J].

HALLER, I ;

FEDER, R ;

HATZAKIS, M ;

SPILLER, E .

JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1979, 126 (01) :154-161

[3] 50-NM SILICON STRUCTURES FABRICATED WITH TRILEVEL ELECTRON-BEAM RESIST AND REACTIVE-ION ETCHING [J].

JACKEL, LD ;

HOWARD, RE ;

HU, EL ;

TENNANT, DM ;

GRABBE, P .

APPLIED PHYSICS LETTERS, 1981, 39 (03) :268-270

[4]

JAIN K, 1982, APPL PHYS B-PHOTO, V28, P206

[5]

JAIN K, 1982, 1982 S VLSI TECHN OI

[6] DEEP UV SUB-MICRON LITHOGRAPHY BY USING A PULSED HIGH-POWER EXCIMER LASER [J].

KAWAMURA, Y ;

TOYODA, K ;

NAMBA, S .

JOURNAL OF APPLIED PHYSICS, 1982, 53 (09) :6489-6490

[7]

SAMSON JAR, 1980, TECHNIQUES VACUUM UL

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