INTERFACIAL REACTIONS OF W THIN-FILM ON SINGLE-CRYSTAL (001)BETA-SIC

被引:45
作者
BAUD, L
JAUSSAUD, C
MADAR, R
BERNARD, C
CHEN, JS
NICOLET, MA
机构
[1] ECOLE NATL SUPER PHYS GRENOBLE,MAT & GENIE PHYS LAB,F-38402 ST MARTIN DHERES,FRANCE
[2] ECOLE NATL SUPER ELECTROCHIM & ELECTROME GRENOBLE,LTPCM,F-38402 ST MARTIN DHERES,FRANCE
[3] CALTECH,PASADENA,CA 91125
来源
MATERIALS SCIENCE AND ENGINEERING B-SOLID STATE MATERIALS FOR ADVANCED TECHNOLOGY | 1995年 / 29卷 / 1-3期
关键词
SILICON CARBIDE; DIFFUSION; TUNGSTEN; CONTACT RESISTANCE;
D O I
10.1016/0921-5107(94)04017-X
中图分类号
T [工业技术];
学科分类号
08 ;
摘要
Interfacial reactions between a W thin film and a single-crystal (001) beta-SiC substrate on rapid thermal annealing a from 600 degrees C to 1100 degrees C for 60 a were investigated by backscattering,o spectrometry, X-ray diffraction, secondary ion mass spectrometry and cross-sectional transmission electron microscopy. Backscattering spectrometry shows that W reacts with SiC at 950 degrees C. The product phases identified by X-ray diffraction are W5Si3 and W2C. At 1100 degrees C no more unreacted W is detected. Current-voltage measurements show that ohmic contacts are already obtained on as-deposited W. Contact resistivity measured using the circular transmission line model is about 10(-3) Ohm cm(2). Thermodynamic studies of the solid phase stability in the ternary W-Si-C system help us to understand the chemical stability of W thin film.
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页码:126 / 130
页数:5
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