学术探索
学术期刊
新闻热点
数据分析
智能评审
立即登录
INFLUENCE OF CU AS AN IMPURITY IN AL/TI AND AL/W THIN-FILM REACTIONS
被引:65
作者
:
KRAFCSIK, I
论文数:
0
引用数:
0
h-index:
0
机构:
CORNELL UNIV,DEPT MAT SCI & ENGN,ITHACA,NY 14853
CORNELL UNIV,DEPT MAT SCI & ENGN,ITHACA,NY 14853
KRAFCSIK, I
[
1
]
GYULAI, J
论文数:
0
引用数:
0
h-index:
0
机构:
CORNELL UNIV,DEPT MAT SCI & ENGN,ITHACA,NY 14853
CORNELL UNIV,DEPT MAT SCI & ENGN,ITHACA,NY 14853
GYULAI, J
[
1
]
PALMSTROM, CJ
论文数:
0
引用数:
0
h-index:
0
机构:
CORNELL UNIV,DEPT MAT SCI & ENGN,ITHACA,NY 14853
CORNELL UNIV,DEPT MAT SCI & ENGN,ITHACA,NY 14853
PALMSTROM, CJ
[
1
]
MAYER, JW
论文数:
0
引用数:
0
h-index:
0
机构:
CORNELL UNIV,DEPT MAT SCI & ENGN,ITHACA,NY 14853
CORNELL UNIV,DEPT MAT SCI & ENGN,ITHACA,NY 14853
MAYER, JW
[
1
]
机构
:
[1]
CORNELL UNIV,DEPT MAT SCI & ENGN,ITHACA,NY 14853
来源
:
APPLIED PHYSICS LETTERS
|
1983年
/ 43卷
/ 11期
关键词
:
D O I
:
10.1063/1.94212
中图分类号
:
O59 [应用物理学];
学科分类号
:
摘要
:
引用
收藏
页码:1015 / 1017
页数:3
相关论文
共 14 条
[11]
DIFFUSION BARRIERS IN THIN-FILMS
NICOLET, MA
论文数:
0
引用数:
0
h-index:
0
NICOLET, MA
[J].
THIN SOLID FILMS,
1978,
52
(03)
: 415
-
443
[12]
OTTAVIANI G, 1981, RELIABILITY DEGRADAT, pCH2
[13]
EFFECT OF DIRECT-CURRENT ON PRECIPITATION IN QUENCHED AL+4 PERCENT CU TIN FILMS
SHINE, MC
论文数:
0
引用数:
0
h-index:
0
SHINE, MC
HERD, SR
论文数:
0
引用数:
0
h-index:
0
HERD, SR
[J].
APPLIED PHYSICS LETTERS,
1972,
20
(06)
: 217
-
&
[14]
ELECTRICAL-PROPERTIES OF AL/TI CONTACT METALLURGY FOR VLSI APPLICATION
TING, CY
论文数:
0
引用数:
0
h-index:
0
TING, CY
CROWDER, BL
论文数:
0
引用数:
0
h-index:
0
CROWDER, BL
[J].
JOURNAL OF THE ELECTROCHEMICAL SOCIETY,
1982,
129
(11)
: 2590
-
2594
←
1
2
→
共 14 条
[11]
DIFFUSION BARRIERS IN THIN-FILMS
NICOLET, MA
论文数:
0
引用数:
0
h-index:
0
NICOLET, MA
[J].
THIN SOLID FILMS,
1978,
52
(03)
: 415
-
443
[12]
OTTAVIANI G, 1981, RELIABILITY DEGRADAT, pCH2
[13]
EFFECT OF DIRECT-CURRENT ON PRECIPITATION IN QUENCHED AL+4 PERCENT CU TIN FILMS
SHINE, MC
论文数:
0
引用数:
0
h-index:
0
SHINE, MC
HERD, SR
论文数:
0
引用数:
0
h-index:
0
HERD, SR
[J].
APPLIED PHYSICS LETTERS,
1972,
20
(06)
: 217
-
&
[14]
ELECTRICAL-PROPERTIES OF AL/TI CONTACT METALLURGY FOR VLSI APPLICATION
TING, CY
论文数:
0
引用数:
0
h-index:
0
TING, CY
CROWDER, BL
论文数:
0
引用数:
0
h-index:
0
CROWDER, BL
[J].
JOURNAL OF THE ELECTROCHEMICAL SOCIETY,
1982,
129
(11)
: 2590
-
2594
←
1
2
→