SELECTIVE AND STOICHIOMETRIC REACTION OF COPPER DIPIVALOYLMETHANATE [CU(DPM)2] WITH SURFACE HYDROXYLS ON SIO2

被引:37
作者
SEKINE, R [1 ]
KAWAI, M [1 ]
机构
[1] INST PHYS & CHEM RES,WAKO,SAITAMA 35101,JAPAN
关键词
D O I
10.1063/1.102500
中图分类号
O59 [应用物理学];
学科分类号
摘要
Stoichiometric reaction of copper dipivaloylmethanate [Cu(DPM)2] with the hydroxyl group (OH) on SiO2 surface was studied by infrared spectroscopy. The stoichiometric ratio of reacted OH and Cu(DPM)2 was estimated to be ∼2-3:1 from the absorbance of the OH and the CH stretching region. The ligand DPM was removed from the SiO2 surface by treatment with water at 400°C. The oxidation state of Cu remaining on the surface was proven to be +1 by x-ray photoelectron spectroscopy.
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页码:1466 / 1468
页数:3
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