POLYMER BEHAVIOR UNDER PLASMA-ETCHING - INFLUENCE OF PHYSICAL-PROPERTIES ON KINETICS AND DURABILITY

被引：15

作者：

JOUBERT, O ^{[1
]}

PANIEZ, P ^{[1
]}

PONS, M ^{[1
]}

PELLETIER, J ^{[1
]}

机构：

[1] CTR NATL ETUD TELECOMMUN GRENOBLE,F-38243 MEYLAN,FRANCE

来源：

JOURNAL OF APPLIED PHYSICS | 1991年 / 70卷 / 02期

关键词：

D O I：

10.1063/1.349609

中图分类号：

O59 [应用物理学];

学科分类号：

摘要：

The influence of the physical properties of polymers on their plasma behavior has been investigated under O2 and Ar plasma treatments. The glass transition temperature (T(g)) has been found to be an important parameter. A steplike increase in the etch kinetics in O2 plasmas has been correlated to the change in the heat capacity of the polymer occurring above T(g) whatever the molecular weight of the polymer. Furthermore, above T(g), changes in the viscoelastic properties induce bulk polymer degradation if chain crosslinking cannot be achieved before or during plasma etching.

引用

页码：977 / 982

页数：6

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