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ENCAPSULATING MICROELECTRONIC IMPLANTS IN ONE-PART SILICONE RUBBERS

被引：25
作者：
DONALDSON, PEK
机构：
来源：
MEDICAL & BIOLOGICAL ENGINEERING & COMPUTING | 1989年 / 27卷 / 01期
关键词：
D O I：
10.1007/BF02442177
中图分类号：
TP39 [计算机的应用];
学科分类号：
081203 ; 0835 ;
摘要：
引用
收藏
页码：93 / 94
页数：2
相关论文
共 5 条
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[2]   THE LIFE OF NEUROLOGICAL PROSTHESES [J].
DONALDSON, PEK .
JOURNAL OF BIOMEDICAL ENGINEERING, 1981, 3 (04) :294-296
[3]   VACUUM CENTRIFUGE FOR VOID-FREE POTTING OF IMPLANTABLE HYBRID MICROCIRCUITS IN SILICONE [J].
DONALDSON, PEK ;
SAYER, E .
MEDICAL & BIOLOGICAL ENGINEERING, 1975, 13 (04) :595-596
[4]   SILICONE-RUBBER ADHESIVES AS ENCAPSULANTS FOR MICROELECTRONIC IMPLANTS - EFFECT OF HIGH ELECTRIC-FIELDS AND OF TENSILE-STRESS [J].
DONALDSON, PEK ;
SAYER, E .
MEDICAL & BIOLOGICAL ENGINEERING & COMPUTING, 1977, 15 (06) :712-715
[5]  
DONALDSON PEK, 1982, JUL P INT C BIOM POL, P143
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