NODULATION OF ELECTRODEPOSITED COPPER DUE TO SUSPENDED PARTICULATE

被引:38
作者
ANDERSEN, TN [1 ]
PITT, CH [1 ]
LIVINGSTON, LS [1 ]
机构
[1] UNIV UTAH,DEPT MET & MET ENGN,SALT LAKE CITY,UT 84112
关键词
D O I
10.1007/BF00617517
中图分类号
O646 [电化学、电解、磁化学];
学科分类号
081704 ;
摘要
引用
收藏
页码:429 / 438
页数:10
相关论文
共 20 条
[1]  
BOCKRIS JO, 1967, FUNDAMENTAL ASPECTS, pCH11
[2]  
BOCKRIS JO, 1972, MODERN ELECTROCHEMIS, V2, P1058
[3]  
BRAUN TB, 1976, EXTRACTIVE METALLURG, V2, P511
[4]   KINETICS OF DEPOSITION OF ALUMINA PARTICLES FROM COPPER-SULFATE PLATING BATHS [J].
CELIS, JP ;
ROOS, JR .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1977, 124 (10) :1508-1511
[5]   CODEPOSITION OF ALUMINA AND TITANIA WITH COPPER [J].
CHEN, ES ;
LAKSHMINARAYANAN, GR ;
SAUTTER, FK .
METALLURGICAL TRANSACTIONS, 1971, 2 (04) :937-+
[6]  
EICHRODT CW, 1954, COPPER SCI TECHNOLOG, pCH8
[7]  
FENEAU C, 1967, IND CHIM BELGE, V32, P241
[8]  
Fischer H., 1954, ELEKTROLYTISCHE ABSC, P729
[9]   KINETICS OF DEPOSITION OF INERT PARTICLES FROM ELECTROLYTIC BATHS [J].
GUGLIELMI, N .
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1972, 119 (08) :1009-+
[10]  
Hopkins W. R., 1973, INT S HYDR, P127