USE OF AUTORADIOGRAPHY IN THE STUDY OF ALUMINUM ELECTROMIGRATION

[1] ADDA Y, 1966, DIFFUSION SOLIDES, V2, P672

[2] BLECH IA, 1970, HDB THIN FILM TECHNO, P23

[3] BOLTAKS BI, 1963, DIFFUSION SEMICONDUC, P126

[4] CURRENT-INDUCED MARKER MOTION IN GOLD WIRES [J]. JOURNAL OF PHYSICS AND CHEMISTRY OF SOLIDS, 1961, 20 (1-2) : 76 - 87

[5] VALUE D0Z' FOR GRAIN BOUNDARY ELECTROMIGRATION IN ALUMINUM FILMS [J]. APPLIED PHYSICS LETTERS, 1970, 16 (01) : 27 - +

[6] SEIBEL G, 1963, THESIS U PARIS

[7] FAILURE PHYSICS OF INTEGRATED-CIRCUITS - A REVIEW [J]. MICROELECTRONICS RELIABILITY, 1983, 23 (04) : 609 - 707

[8] GRAIN-BOUNDARY ELECTROMIGRATION IN THIN-FILMS .1. LOW-TEMPERATURE THEORY [J]. JOURNAL OF APPLIED PHYSICS, 1977, 48 (01) : 28 - 35

[9] TAI KL, 1977, J APPL PHYS, V48, P37

[10] von Staszewski G. M., 1980, Solid-State Electronics, V23, P481, DOI 10.1016/0038-1101(80)90085-4

[1] ADDA Y, 1966, DIFFUSION SOLIDES, V2, P672

[2] BLECH IA, 1970, HDB THIN FILM TECHNO, P23

[3] BOLTAKS BI, 1963, DIFFUSION SEMICONDUC, P126

[4] CURRENT-INDUCED MARKER MOTION IN GOLD WIRES [J]. JOURNAL OF PHYSICS AND CHEMISTRY OF SOLIDS, 1961, 20 (1-2) : 76 - 87

[5] VALUE D0Z' FOR GRAIN BOUNDARY ELECTROMIGRATION IN ALUMINUM FILMS [J]. APPLIED PHYSICS LETTERS, 1970, 16 (01) : 27 - +

[6] SEIBEL G, 1963, THESIS U PARIS

[7] FAILURE PHYSICS OF INTEGRATED-CIRCUITS - A REVIEW [J]. MICROELECTRONICS RELIABILITY, 1983, 23 (04) : 609 - 707

[8] GRAIN-BOUNDARY ELECTROMIGRATION IN THIN-FILMS .1. LOW-TEMPERATURE THEORY [J]. JOURNAL OF APPLIED PHYSICS, 1977, 48 (01) : 28 - 35

[9] TAI KL, 1977, J APPL PHYS, V48, P37

[10] von Staszewski G. M., 1980, Solid-State Electronics, V23, P481, DOI 10.1016/0038-1101(80)90085-4