HIGH-POWER, SINGLEMODE INGAAS-GAAS-ALGAAS STRAINED QUANTUM-WELL LASERS WITH NEW CURRENT BLOCKING SCHEME USING GAAS-LAYERS GROWN BY MBE AT LOW SUBSTRATE TEMPERATURES

被引:8
作者
SIN, YK
HORIKAWA, H
MATSUYAMA, I
KAMIJOH, T
机构
[1] Semiconductor Technology Laboratory, Oki Electric Industry Co., Ltd., Hachioji, Tokyo 193, 550-t, Higashiasakawa
关键词
SEMICONDUCTOR LASERS; LASERS;
D O I
10.1049/el:19920506
中图分类号
TM [电工技术]; TN [电子技术、通信技术];
学科分类号
0808 ; 0809 ;
摘要
Device results from laser diodes with a new current blocking scheme using low temperature (LT) GaAs grown by MBE at 200-degrees-C are reported. The laser structure is grown by metal organic vapour phase epitaxy on channelled MBE-grown LT-GaAs. The LT-GaAs is shown to be effective in preserving the current blocking properties for InGaAs-GaAs-AlGaAs strained quantum well lasers. The CW laser threshold is 50mA at RT (with a lasing wavelength of 980 nm) and far field patterns show fundamental modes (both lateral and transverse modes) even at an output power of 55 mW (per facet, uncoated). FWHMs of far field patterns parallel and perpendicular to the junction plane are 16 and 39-degrees at an output power of 55 mW, respectively.
引用
收藏
页码:803 / 804
页数:2
相关论文
共 4 条
[1]   STRAINED-LAYER INGAAS-GAAS-ALGAAS PHOTOPUMPED AND CURRENT INJECTION-LASERS [J].
KOLBAS, RM ;
ANDERSON, NG ;
LAIDIG, WD ;
SIN, YK ;
LO, YC ;
HSIEH, KY ;
YANG, YJ .
IEEE JOURNAL OF QUANTUM ELECTRONICS, 1988, 24 (08) :1605-1613
[2]   LOW THRESHOLD CURRENT GAAS ALGAAS GRIN-SCH LASERS GROWN BY MOLECULAR-BEAM EPITAXY ON SI3N4 MASKED SUBSTRATES [J].
MEIER, HP ;
VANGIESON, E ;
WALTER, W ;
HARDER, C ;
BUCHMANN, P ;
WEBB, D ;
MOSER, A .
ELECTRONICS LETTERS, 1988, 24 (18) :1123-1125
[3]   SURFACE AND BULK LEAKAGE CURRENTS IN TRANSVERSE JUNCTION STRIPE LASERS [J].
SIN, YK ;
HSIEH, KY ;
LEE, JH ;
KOLBAS, RM .
JOURNAL OF APPLIED PHYSICS, 1991, 69 (02) :1081-1090
[4]   DIFFUSION OF ZINC INTO GAAS-LAYERS GROWN BY MOLECULAR-BEAM EPITAXY AT LOW SUBSTRATE TEMPERATURES [J].
SIN, YK ;
HWANG, Y ;
ZHANG, T ;
KOLBAS, RM .
JOURNAL OF ELECTRONIC MATERIALS, 1991, 20 (06) :465-469